New Technology Packaging Solves The Heat Dissipation Problem of LED Screen
Currently, almost all LED display manufacturers face the problem of heat dissipation during PCB design, with the thermal effect of drivers disturbing the normal light emitting property of LED and further influencing the color uniformity of the overall display. This article will illustrate how headaches can be prevented by changing the packaging of driving chips.
QFN is a new surface mounting technology (SMT) encapsulated in plastic and features its small size and dimension, with a welding plate on the bottom. Unlike conventional SOIC packaging, there is no L-shape wire in QFN, thus the conductive channel is shorter and the coefficient of self-induction and resistance of the wire inside the package is lower, so it provides excellent electrical performance. Also, as the elimination of the L-shape wire reduces the antenna effect, the EMC/EMI is reduced in QFN package. Additionally, it provides good heat dissipation via the exposed lead die-pad. The pad has direct heat dissipation passage to release the heat of the chip inside the package. Usually the pad is directly welded to the circuit board and the heat emission holes in the PCB can help dismiss the extra power consumption to the brass-connected floor to absorb the redundant heat as well as reach better common ground effect. The QFN package has already been widely used in handsets and Notebooks, while is on the point of booming in LED display field.
