MiP stands for Micro LED in Package. It is a packaging process that focuses on new micro LED crystal particles, that is, encapsulating Micro LED chips in micro substrates (such as silicon-based or PCB), which is compatible with existing SMD production lines, greatly reducing the difficulty and cost of Mini LED production (the cost is expected to be reduced by 30% compared with COB solutions).
Industry experts believe that MiP will serve as the industry standard in the range of P0.2 to P3.0, leading the market trend
MiP packaging advantages
MiP packaging advantages
Compared with traditional COB, SMD and IMD packaging structures, MiP can adapt to smaller line width packaging requirements, and its packaging size can reach less than 60um, which is much smaller than the chip size that can be packaged by other packaging structures. This means that MiP is the only option that can meet the micro LED packaging needs, while other packaging structures are either unachievable or have challenges in reliability and economy.
Application scenarios: shopping mall naked eye 3D screens, museum digital exhibition walls, educational institutions interactive blackboards, etc., taking into account high-definition display and economy.