GOB, short for GLUE ON THE BOARD, is a new type of optically conductive, thermally conductive nano-filled material. Through a special process, conventional LED display PCBs and their SMD LEDs are treated with a double-matte optical treatment to achieve a frosted effect on the surface of the LED display. This improves existing LED display protection technology and innovatively achieves the conversion of point light sources from surface light sources. It has a broad market in various fields.
The GOB process addresses industry pain points. Currently, traditional screens have completely exposed light sources, resulting in serious drawbacks.
1. Low protection: They lack moisture, water, dust, shock, and impact resistance. In humid climates, a high number of lamp failures and burnouts are common. Lamps can easily fall and break during transportation. They are also susceptible to static electricity, causing lamp failures.
2. Harmful to the eyes: Prolonged viewing can cause glare and fatigue, leaving the eyes unprotected. Furthermore, there's a "blue light damage" effect. Due to the short wavelength and high frequency of blue LEDs, long-term direct exposure to blue light can easily lead to retinal disease.
Advantages of the GOB process: 1. Eight protections: waterproof, moisture-proof, impact-proof, dust-proof, corrosion-proof, blue light-proof, salt-proof, and anti-static. 2. The frosted surface improves color contrast, enabling the transition from point light sources to area light sources, increasing viewing angles.
Detailed Explanation of the GOB Process: The GOB process truly meets the product characteristics of LED displays, ensuring standardized mass production with high quality and performance. This requires a complete production process, reliable automated production equipment developed in conjunction with production process research and development, a custom A-type mold, and packaging materials tailored to the product's specific requirements.
GOB packaging materials must be custom-made according to the GOB process plan and meet the following properties: 1. Strong adhesion; 2. Strong tensile and vertical impact resistance; 3. Hardness; 4. High transparency; 5. Temperature resistance; 6. Yellowing resistance; 7. Salt spray resistance; 8. High abrasion resistance; 9. Antistatic; 10. High voltage resistance.
The GOB encapsulation process must ensure that the encapsulation material completely fills the spaces between the LEDs, covers the surface of the LEDs, and is securely attached to the PCB. There should be no bubbles, pinholes, white spots, voids, or underfill on the bonding surface between the PCB and the adhesive.
Thickness peeling: Consistency of adhesive layer thickness (precisely defined as the consistency of the adhesive layer thickness on the surface of the LEDs). After GOB packaging, the uniformity of the adhesive layer thickness on the surface of the LEDs must be ensured. The GOB process has been fully upgraded to 4.0, resulting in virtually no tolerance on adhesive layer thickness. The thickness tolerance of the original module is the same as the finished module. The thickness tolerance of the original module can even be reduced. Perfect joint flatness!
